ST10F296 datasheet(293/346 Pages) STMICROELECTRONICS

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24.2

Recommended operating conditions

24.3

Power considerations

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the

following equation:

Equation 22

Where:

TA is the ambient temperature in ° C.

ΘJA is the package junction-to-ambient thermal resistance, in ° C/W.

PD is the sum of PINT and PI/O (PD = PINT + PI/O).

PINT is the product of IDD and VDD, expressed in Watts. This is the chip internal power.

PI/O represents the power dissipation on the input and output pins which is user determined.

Usually, PI/O< PINT can be neglected. PI/O may be significant if the device is configured to

drive external modules and/or memories continuously.

An approximate relationship between PD and TJ (if PI/O is neglected) is given by:

Equation 23

Table 160.

Recommended operating conditions

Symbol

Parameter

Min

Max

Unit

VDD

Operating supply voltage

4.5

5.5

VSTBY

Operating standby supply voltage(1)

The value of the VSTBY voltage is in the range 4.5 to 5.5 volts. It is acceptable to exceed the upper limit (up

to 6.0 volts) for a maximum of 100 hours over 300 000 hours (about 30 years), which represents the

lifetime of the device. When VSTBY voltage is lower than main VDD, the input section of VSTBY/EA pin can

generate a spurious static consumption on VDD power supply (in the range of a tenth of a µA).

VAREF

Operating analog reference voltage(2)

For details on operating conditions concerning the use of the ADC, refer to Section 24.7: ADC

characteristics.

VDD

Ambient temperature under bias

–40

+125

°C

Junction temperature under bias

+150

()

273

° C

()

⁄

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