7/9

Part No. : LTLA2V3EX3K

BNS-OD-FC002/A4

Through Hole Lamp

LTLA2V3EX3K

8. CAUTIONS

8.1. Application

This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment.

8.2. Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that

LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is

recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen

ambient.

8.3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.

8.4. Lead Forming & Assembly

During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the

lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly

on PCB, use minimum clinch force possible to avoid excessive mechanical stress.

8.5. Soldering

When soldering, leave a minimum of 3mm clearance from the base of the lens to the soldering point. Dipping the lens into the

solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high

temperature.

Recommended soldering conditions:

Soldering iron

Wave soldering

Temperature

Soldering time

Position

350°C Max.

3 seconds Max.

(one time only)

No closer than 2mm

from the base of the epoxy bulb

Pre-heat

Pre-heat time

Solder wave

Soldering time

Dipping Position

100°C Max.

60 seconds Max.

260°C Max.

5 seconds Max.

No lower than 2mm from the

base of the epoxy bulb

Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic

failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.

Wave soldering profile (under PCB); turning off top heater in preheating stage is recommended