AD9546SLASHPCBZ datasheet(205/205 Pages) AD

205 / 205 page

Data Sheet

AD9546

Rev. 0 | Page 205 of 205

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-4.

0.50

BSC

BOTTOM VIEW

TOP VIEW

5.70

5.60 SQ

5.50

0.50

0.40

0.30

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.18

7.10

7.00 SQ

6.90

0.20 MIN

5.50 REF

END VIEW

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 147. 48-Lead Lead Frame Chip Scale Package [LFCSP]

7 mm × 7 mm Body and 0.75 mm Package Height

(CP-48-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD9546BCPZ

−40°C to +85°C

48-Lead Lead Frame Chip Scale Package [LFCSP)

CP-48-13

AD9546BCPZ-REEL7

−40°C to +85°C

48-Lead Lead Frame Chip Scale Package [LFCSP]

CP-48-13

AD9546/PCBZ

−40°C to +85°C

Evaluation Board

Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D23266-10/20(0)

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