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STM32H723VG 데이터시트(PDF) 215 Page - STMicroelectronics |
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STM32H723VG 데이터시트(HTML) 215 Page - STMicroelectronics |
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215 / 227 page ![]() DS13313 Rev 2 215/227 STM32H723xE/G Package information 225 Device marking for TFBGA100 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 70. TFBGA100 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 122. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.400 mm Dsm 0.470 mm typ (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm MSv53063V2 Revision code Ball A1identifier STM32H723 VGH6 Y WW Product identification (1) Date code R |
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