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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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VSC8658 데이터시트(PDF) 90 Page - Microsemi Corporation |
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VSC8658 데이터시트(HTML) 90 Page - Microsemi Corporation |
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90 / 95 page  Package Information VMDS-10242 VSC8658 Datasheet Revision 4.1 82 8 Package Information The VSC8658 device is available in two package types. VSC8658HJ is a 444-pin, thermally enhanced, plastic ball grid array (BGA) with a 27 mm × 27 mm body size, 1 mm pin pitch, and a 2.36 mm maximum height. The device is also available in a lead(Pb)-free package, VSC8658XHJ. Lead(Pb)-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. This section provides the package drawing, thermal specifications, and moisture sensitivity rating for the VSC8658 device. 8.1 Package Drawing The following illustration shows the package drawing for the VSC8658 device. The drawing contains the top view, bottom view, side view, dimensions, tolerances, and notes. |
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