7.4 Thermal Information: OPA182

THERMAL METRIC(1)

OPA182

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

112.9

°C/W

Junction-to-case (top) thermal resistance

50.8

°C/W

Junction-to-board thermal resistance

56.2

°C/W

Junction-to-top characterization parameter

10.1

°C/W

Junction-to-board characterization parameter

55.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2182

THERMAL METRIC(1)

OPA2182

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

108.1

150.2

°C/W

Junction-to-case (top) thermal resistance

45.8

43.9

°C/W

Junction-to-board thermal resistance

51.3

71.4

°C/W

Junction-to-top characterization parameter

7.2

2.9

°C/W

Junction-to-board characterization parameter

50.6

70.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4182

THERMAL METRIC(1)

OPA4182

UNIT

D (SOIC)

14 PINS

Junction-to-ambient thermal resistance

112.9

°C/W

Junction-to-case (top) thermal resistance

50.8

°C/W

Junction-to-board thermal resistance

56.2

°C/W

Junction-to-top characterization parameter

10.1

°C/W

Junction-to-board characterization parameter

55.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

OPA182, OPA2182, OPA4182

SBOS936D – DECEMBER 2019 – REVISED DECEMBER 2021

Copyright © 2021 Texas Instruments Incorporated

Submit Document Feedback

7

Product Folder Links: OPA182 OPA2182 OPA4182