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SPC572L60F2 데이터시트(PDF) 23 Page - STMicroelectronics

부품명 SPC572L60F2
상세설명  32-bit Power Architecture® based MCU for automotive powertrain applications
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SPC572Lx
Electrical characteristics
111
3.8
I/O pad specification
The following table describes the different pad type configurations.
Table 10. DC electrical specifications(1)
Symbol
C
Parameter
Conditions
Value
Unit
Min
Typ
Max
IDD
CC P Operating current all
supply rails
fMAX(2)
—
—
145
mA
IDDPE
CC C Operating current all
supplies including
program/erase
fMAX(3)
—
—
165
mA
IDDAPP
CC P Operating current all
supplies with typical
application
At TJ<150°C
—
—
125
mA
IDDAR
CC P VDD_HV_IO After Run
operating current
At 40 °C
Total device consumption
on VDD_HV_IO, including
consumption for VDD_LV
generation.
No I/O activity
——
22
mA
CC T
After-run mode HV
current, TA =55 °C,
VDD_HV_IO = 5.5 V
——
24
ISPIKE
CC T Maximum short term
current spike
< 20 µs observation
window
——
60
mA
dI
CC T Current difference ratio to
average current (dI/avg(I))
< 20 µs observation
window
——
20
%
ISR
CC D Current variation during
boot/shut-down
——
—
50
mA
VREF_BG_T
CC P Bandgap trimmed
reference voltage
TJ = –40 °C to 150 °C
VDD_HV_ADV = 5 V + 10%
1.200
—
1.237
V
VREF_BG_TC
CC C Bandgap temperature
coefficient(4)
TJ = –40 °C to 150 °C
VDD_HV_ADV = 5 V + 10%
-50
—
50
ppm
/°C
VREF_BG_LR
CC C Bandgap line regulation
TJ = –40 °C
VDD_HV_ADV = 5 V + 10%
—
—
8000
ppm
/V
CTJ = 150 °C
VDD_HV_ADV = 5 V + 10%
—
—
4000
1. The ranges in this table are design targets and actual data may vary in the given range.
2. fMAX as specified per IP, unloaded I/O with LVDS pins active and terminated. Measured on an application specific pattern.
3. fMAX as specified per IP, unloaded I/O with LVDS pins active and terminated. Measured on an application specific pattern
with active flash program and erase.
4. The temperature coefficient and line regulation specifications are used to calculate the reference voltage drift at an
operating point within the specified voltage and temperature operating conditions.



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