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STM32WB15CC 데이터시트(PDF) 119 Page - STMicroelectronics |
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STM32WB15CC 데이터시트(HTML) 119 Page - STMicroelectronics |
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119 / 127 page ![]() DS13258 Rev 4 119/127 STM32WB15CC Package information 124 7.2 WLCSP49 package information This WLCSP is a 49-ball, 3.30 x 3.38 mm, 0.4 mm pitch, wafer level chip scale package. Figure 30. WLCSP49 outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. e1 G F e D D H K e2 E A1 DETAIL A bbb aaa (4x) A2 A SIDE VIEW BOTTOM VIEW TOP VIEW A3 A2 b FRONT VIEW BUMP A1 ddd ccc Z ZX Y b (49x) DETAIL A ROTATED 90 SEATING PLANE B0DE_WLCSP49_ME_V1 A1 BALL LOCATION A1 BALL LOCATION Z |
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