STM32WB15CC datasheet(122/127 Pages) STMICROELECTRONICS

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Package information

STM32WB15CC

122/127

DS13258 Rev 4

7.3

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 24: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated

using the equation:

TJ max = TA max + (PD max x ΘJA)

where:



TA max is the maximum ambient temperature in °C,



ΘJA is the package junction-to-ambient thermal resistance, in °C / W,



PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max),



PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins:



PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Note:

As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the

chip power consumption.

Note:

RF characteristics (such as sensitivity, Tx power, consumption) are provided up to 85 °C.

7.3.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

7.3.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the information

scheme shown in Section 8.

Table 86. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

UFQFPN48 - 7 mm x 7 mm

27.7

°C / W

Thermal resistance junction-ambient

WLCSP49 - 0.4 mm pitch

45.5

ΘJB

Thermal resistance junction-board

UFQFPN48 - 7 mm x 7 mm

12.0

Thermal resistance junction-board

WLCSP49 - 0.4 mm pitch

ΘJC

Thermal resistance junction-case

UFQFPN48 - 7 mm x 7 mm

9.7

Thermal resistance junction-case

WLCSP49 - 0.4 mm pitch

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