MSP430 datasheet(5/88 Pages) TI

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

PVDD, IOVDD to GND

–0.3

5.5

VDD to GND

–0.3

1.98

AIN0, POL_SEL/AIN1, VOUT to GND

–0.3

PVDD + 0.3

Digital Input/Output to GND

–0.3

IOVDD + 0.3

VREFIO to GND

–0.3

VDD + 0.3

REF_GND to GND

–0.3

0.3

Input current

Current into any pin

–10

Junction temperature

–55

150

°C

Tstg

Storage temperature

–65

150

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

PVDD to GND

PVDD > 2.7 V, VDD internally generated

2.7

5.5

PVDD = VDD

1.71

1.89

VDD to GND

1.71

1.89

IOVDD to GND

1.71

5.5

VREFIO to GND

External VREF

1.2

1.25

1.3

Ambient temperature

Specified

–40

125

°C

Operating

–55

125

6.4 Thermal Information

THERMAL METRIC(1)

AFEx8101

UNIT

RRU (UQFN)

24 PINS

RθJA

Junction-to-ambient thermal resistance

103.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

84.4

°C/W

RθJC(bottom)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJB

Junction-to-board thermal resistance

69.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.4

°C/W

ΨJB

Junction-to-board characterization parameter

68.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

AFE78101, AFE88101

SLASF21 – DECEMBER 2022

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