P9221-R3 Datasheet

© 2017 Integrated Device Technology, Inc.

9

October 20, 2017

4. Thermal Characteristics

Table 4.

Package Thermal Information

Note: This thermal rating was calculated on a JEDEC 51 standard 4-layer board with dimensions 76.2 x 114.3 mm in still air conditions.

Symbol

Description

WLCSP Rating 8 Thermal Balls

Units

θJA

Thermal Resistance Junction to Ambient[a]

47

C/W

θJC

Thermal Resistance Junction to Case

0.202

C/W

θJB

Thermal Resistance Junction to Board

4.36

C/W

TJ

Operating Junction Temperature[a]

-5 to +125

C

TAMB

Ambient Operating Temperature[a]

0 to +85

C

TSTOR

Storage Temperature

-55 to +150

C

TBUMP

Maximum Soldering Temperature (Reflow, Pb-Free)

260

C

[a] The maximum power dissipation is PD(MAX) = (TJ(MAX) - TAMB) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation

will result in excessive die temperature, and the device will enter thermal shutdown. Refer to section 13.1 for further details.

5. Electrical Characteristics

Table 5.

Electrical Characteristics

Note: VRECT = 5.5V; COUT = 4.7μF, EN

̅̅̅̅ = LOW, unless otherwise noted. TJ = 0C to 125C; typical values are at 25°C.

Note: See important notes at the end of this table.

Symbol

Description

Conditions

Min

Typical

Max

Units

Under-Voltage Lock-Out (UVLO)

VUVLO_Rising

UVLO Rising

Rising voltage on VRECT

2.9

2.98

V

VUVLO_HYS

UVLO Hysteresis

VRECT falling

200

mV

Over-Voltage Protection

VOVP-DC

DC Over-Voltage

Protection

Rising voltage on VRECT

17

V

VOVP-HYS

Over-Voltage Hysteresis

1

V

Quiescent Current

IACTIVE_SUPLY

Supply Current

EN

¯¯ = Low, No load; VRECT = 12.3V

3.0

mA

ISHD

Shut Down Mode Current

EN

¯¯ = High; VRECT = 12.3V

500

μA

VDD18 Voltage

VVDD18

VDD18 Pin Output

Voltage[a]

IVDD18 = 10mA, CVDD18 = 1µF

1.62

1.8

1.98

V