전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

TMPR4955F 데이터시트(PDF) 29 Page - Toshiba Semiconductor

부품명 TMPR4955F
상세설명  64-Bit TX System RISC TX49 Family
PDF  168 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  TOSHIBA [Toshiba Semiconductor]
홈페이지  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMPR4955F 데이터시트(HTML) 29 Page - Toshiba Semiconductor

Back Button TMPR4955F Datasheet HTML 25Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 26Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 27Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 28Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 29Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 30Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 31Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 32Page - Toshiba Semiconductor TMPR4955F Datasheet HTML 33Page - Toshiba Semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 29 / 168 page
background image
3
General Safety Precautions and Usage Considerations
3-9
3.3.10
Decoupling
Spike currents generated during switching can cause Vcc (Vdd) and GND (Vss) voltage levels to
fluctuate, causing ringing in the output waveform or a delay in response speed. (The power supply
and GND wiring impedance is normally 50
Ω to 100 Ω.) For this reason, the impedance of power
supply lines with respect to high frequencies must be kept low. This can be accomplished by using
thick and short wiring for the Vcc (Vdd) and GND (Vss) lines and by installing decoupling
capacitors (of approximately 0.01
µF to 1 µF capacitance) as high-frequency filters between Vcc
(Vdd) and GND (Vss) at strategic locations on the printed circuit board.
For low-frequency filtering, it is a good idea to install a 10- to 100-
µF capacitor on the printed
circuit board (one capacitor will suffice). If the capacitance is excessively large, however, (e.g.
several thousand
µF) latch-up can be a problem. Be sure to choose an appropriate capacitance
value.
An important point about wiring is that, in the case of high-speed logic ICs, noise is caused mainly
by reflection and crosstalk, or by the power supply impedance. Reflections cause increased signal
delay, ringing, overshoot and undershoot, thereby reducing the device’s safety margins with
respect to noise. To prevent reflections, reduce the wiring length by increasing the device
mounting density so as to lower the inductance (L) and capacitance (C) in the wiring. Extreme
care must be taken, however, when taking this corrective measure, since it tends to cause
crosstalk between the wires. In practice, there must be a trade-off between these two factors.
3.3.11
External noise
Printed circuit boards with long I/O or signal pattern lines are
vulnerable to induced noise or surges from outside sources.
Consequently, malfunctions or breakdowns can result from
overcurrent or overvoltage, depending on the types of device
used. To protect against noise, lower the impedance of the
pattern line or insert a noise-canceling circuit. Protective
measures must also be taken against surges.
For details of the appropriate protective measures for a
particular device, consult the relevant databook.
3.3.12
Electromagnetic interference
Widespread use of electrical and electronic equipment in recent years has brought with it radio
and TV reception problems due to electromagnetic interference. To use the radio spectrum
effectively and to maintain radio communications quality, each country has formulated
regulations limiting the amount of electromagnetic interference which can be generated by
individual products.
Electromagnetic interference includes conduction noise propagated through power supply and
telephone lines, and noise from direct electromagnetic waves radiated by equipment. Different
measurement methods and corrective measures are used to assess and counteract each specific
type of noise.
Difficulties in controlling electromagnetic interference derive from the fact that there is no
method available which allows designers to calculate, at the design stage, the strength of the
electromagnetic waves which will emanate from each component in a piece of equipment. For this
reason, it is only after the prototype equipment has been completed that the designer can take
measurements using a dedicated instrument to determine the strength of electromagnetic
interference waves. Yet it is possible during system design to incorporate some measures for the
prevention of electromagnetic interference, which can facilitate taking corrective measures once
the design has been completed. These include installing shields and noise filters, and increasing
Input/Output
Signals



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com