SST26VF032B-104ISLASHSM datasheet(42/82 Pages) MICROCHIP

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SST26VF032B/SST26VF032BA

DS20005218K-page 42

 2013-2022 Microchip Technology Inc. and its subsidiaries

6.0

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings (†)

Temperature under bias ..........................................................................................................................-55°C to +125°C

Storage temperature ...............................................................................................................................-65°C to +150°C

DC voltage on any pin to ground potential .......................................................................................... -0.5V to VDD+0.5V

Transient voltage (<20 ns) on any pin to ground potential .................................................................. -2.0V to VDD+2.0V

Package power dissipation capability (TA = 25°C)....................................................................................................1.0W

Surface mount solder reflow temperature ...................................................................................... 260°C for 10 seconds

Output short circuit current(1) ..................................................................................................................................50 mA

6.1

Power-Up Specifications

All functionalities and DC specifications are specified

for a VDD ramp rate of greater than 1V per 100 ms (0V

to 3.0V in less than 300 ms). See Table 6-3 and

Figure 6-1 for more information.

When VDD drops from the operating voltage to below

the minimum VDD threshold at power-down, all opera-

tions are disabled and the device does not respond to

commands. Data corruption may result if a power-down

occurs while a Write Registers, program, or erase oper-

ation is in progress. See Figure 6-2.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

Note 1: Output shorted for no more than one second. No more than one output shorted at a time.

TABLE 6-1:

OPERATING RANGE

Range

Ambient Temp.

VDD

Industrial

-40°C to +85°C

2.3V-3.6V

Industrial Plus

-40°C to +105°C

Extended

-40°C to +125°C

TABLE 6-2:

AC CONDITIONS OF TEST(1)

Input Rise/Fall Time

Output Load

3ns

CL =30pF

Note 1: See Figure 8-5.

TABLE 6-3:

RECOMMENDED SYSTEM POWER-UP/DOWN TIMINGS

Symbol

Parameter

Minimum

Max

Units

Condition

TPU-READ(1)

VDD Minimum to Read Operation

100

—

µs

TPU-WRITE(1) VDD Minimum to Write Operation

100

—

µs

TPD(1)

Power-down Duration

100

VOFF

VDD off time

—

0.3

0V recommended

Note 1: This parameter is measured only for initial qualification and after a design or process change that could

affect this parameter.

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