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MNSC140CORE 데이터시트(PDF) 37 Page - Freescale Semiconductor, Inc |
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MNSC140CORE 데이터시트(HTML) 37 Page - Freescale Semiconductor, Inc |
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37 / 88 page ![]() Thermal Characteristics MSC8122 Technical Data, Rev. 13 Freescale Semiconductor 2-3 2.3 Thermal Characteristics Table 2-3 describes thermal characteristics of the MSC8122 for the FC-PBGA packages. Section 4.5, Thermal Considerations provides a detailed explanation of these characteristics. 2.4 DC Electrical Characteristics This section describes the DC electrical characteristics for the MSC8122. The measurements in Table 2-4 assume the following system conditions: •TA = 25 °C • VDD = — 300/400 MHz 1.1 V nominal = 1.07–1.13 VDC — 400 MHz 1.2 V nominal = 1.14–1.26 VDC — 500 MHz 1.2 V nominal = 1.16–1.24 VDC • VDDH = 3.3 V ± 5% VDC • GND = 0 VDC Note: The leakage current is measured for nominal VDDH and VDD. Table 2-3. Thermal Characteristics for the MSC8122 Characteristic Symbol FC-PBGA 20 × 20 mm5 Unit Natural Convection 200 ft/min (1 m/s) airflow Junction-to-ambient1, 2 RθJA 26 21 °C/W Junction-to-ambient, four-layer board1, 3 RθJA 19 15 °C/W Junction-to-board (bottom)4 RθJB 9 °C/W Junction-to-case5 RθJC 0.9 °C/W Junction-to-package-top6 ΨJT 1 °C/W Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. |
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