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SN74ACT596 데이터시트(PDF) 16 Page - Texas Instruments |
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SN74ACT596 데이터시트(HTML) 16 Page - Texas Instruments |
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16 / 31 page ![]() 8.2.2 Detailed Design Procedure 1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the device and electrically close to both the VCC and GND pins. An example layout is shown in the Layout section. 2. Ensure the capacitive load at the output is ≤ 50pF. This is not a hard limit; by design, however, it will optimize performance. This can be accomplished by providing short, appropriately sized traces from the SN74ACT596-Q1 to one or more of the receiving devices. 3. Ensure the resistive load at the output is larger than (VCC / IO(max))Ω. Doing this will prevent the maximum output current from the Absolute Maximum Ratings from being violated. Most CMOS inputs have a resistive load measured in MΩ; much larger than the minimum calculated previously. 4. Thermal issues are rarely a concern for logic gates; the power consumption and thermal increase, however, can be calculated using the steps provided in the application report, CMOS Power Consumption and Cpd Calculation. 8.2.3 Application Curves QA QB SER QC QD QE QF QG QH QH¶ SRCLK rising edge shifts data in the serial registers only QA QB SER QC QD QE QF QG QH QH¶ RCLK rising edge shifts data to the output registers Figure 8-2. Simplified Functional Diagram Showing Clock Operation 8.3 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating listed in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For the SN74ACT596- Q1, a 0.1μF bypass capacitor is recommended. To reject different frequencies of noise, use multiple bypass capacitors in parallel. Capacitors with values of 0.1μF and 1μF are commonly used in parallel. 8.4 Layout 8.4.1 Layout Guidelines • Bypass capacitor placement – Place near the positive supply terminal of the device – Provide an electrically short ground return path – Use wide traces to minimize impedance – Keep the device, capacitors, and traces on the same side of the board whenever possible • Signal trace geometry SN74ACT596-Q1 SCASE34 – NOVEMBER 2024 www.ti.com 16 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: SN74ACT596-Q1 |
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