NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4226135/A 08/2020

www.ti.com

WQFN - 0.8 mm max height

INDSTNAME

BQB0016B

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

2.6

2.4

3.6

3.4

0.8 MAX

0.05

0.00

SEATING PLANE

C

(0.2) TYP

2X 0.5

2X

2.5

10X 0.5

1.1

0.9

2.1

1.9

16X 0.5

0.3

16X 0.3

0.2

SYMM

1

2

7

8

9

10

15

16

17

PIN 1 ID

(OPTIONAL)

PIN 1 INDEX AREA

(0.16)

0.1 MIN

(0.13)

SECTION A-A

TYPICAL