PACKAGE

PINS

THERMAL METRIC(1)

UNIT

RθJA

RθJC(top)

RθJB

ΨJT

ΨJB

RθJC(bot)

BQB (WQFN)

16

91.2

95.1

61.4

18.0

61.2

38.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

-40°C to 125°C

UNIT

MIN

TYP

MAX

VOH (4)

IOH = -50µA

4.5V

4.4

4.499

V

5.5V

5.4

5.499

IOH = -24mA

4.5V

3.7

IOH = -24mA

5.5V

4.7

IOH = -75mA(3)

5.5V

3.85

VOL

IOL = 50µA

4.5V

0.001

0.1

V

5.5V

0.001

0.1

IOL = 24mA

4.5V

0.5

IOL = 24mA

5.5V

0.5

IOL = 75mA(3)

5.5V

1.65

II

VI = 5.5V or GND

0V to 5.5V

±1

µA

IOZ

VO = VCC or GND

5.5V

±1

µA

ICC

VI = VCC or GND, IO = 0

5.5V

2

µA

ΔICC

VI = VCC – 2.1V; Any Input

4.5V to 5.5V

200

µA

CI

VI = VCC or GND

5V

2

pF

CO

VO = VCC or GND

5V

4

pF

CPD (1) (2)

CL = 50pF, F = 1MHz

5V

57

pF

(1)

CPD is used to determine the dynamic power consumption, per channel

(2)

PD= VCC 2xFIx(CPD+ CL) where FI= input frequency, CL= output load capacitance, VCC= supply voltage

(3)

Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.

(4)

Applies to QH' output only.

5.6 Timing Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

DESCRIPTION

CONDITION

VCC

-40°C to 125°C

UNIT

MIN

MAX

fclock

Clock frequency

5V

92

MHz

tw

Pulse duration

RCLK or SRCLK high or low

5V

1.5

ns

tw

Pulse duration

SRCLR low

5V

1.8

ns

tsu

Setup time

SER before SRCLK↑

5V

1

ns

tsu

Setup time

SRCLK↑ before RCLK↑

5V

2.5

ns

tsu

Setup time

SRCLR low before RCLK↑

5V

2.4

ns

tsu

Setup time

SRCLR high (inactive) before SRCLK↑

5V

0.4

ns

th

Hold time

SER after SRCLK↑

5V

0.7

ns

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