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LM98640CVAL 데이터시트(PDF) 8 Page - Texas Instruments

부품명 LM98640CVAL
상세설명  LM98640QML-SP Radiation Hardness Assured (RHA), Dual Channel, 14-Bit, 40-MSPS Analog Front End With LVDS Output
PDF  55 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments

LM98640CVAL 데이터시트(HTML) 8 Page - Texas Instruments

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LM98640QML-SP
SNAS461G – MAY 2010 – REVISED NOVEMBER 2018
www.ti.com
Product Folder Links: LM98640QML-SP
Submit Documentation Feedback
Copyright © 2010–2018, Texas Instruments Incorporated
(1)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature,
TA. The maximum allowable power dissipation at any temperature is PD = (T
JMAX – T
A) / θJA. The values for maximum power dissipation
listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven
beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided
(2)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Thermal Information
(1)
THERMAL METRIC(2)
LM98640QML-SP
UNIT
NBB (CFP)
68 PINS
RθJA
Junction-to-ambient thermal resistance
16.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
3.8
RθJB
Junction-to-board thermal resistance
7.6
ψJT
Junction-to-top characterization parameter
1.7
ψJB
Junction-to-board characterization parameter
7.2
RθJC(bottom)
Junction-to-case (bottom) thermal resistance
0.3
6.5 Quality Conformance Inspection
MIL-STD-883, Method 5005 - Group A
SUBGROUP
DESCRIPTION
TEMP (°C)
1
Static tests at
25
2
Static tests at
125
3
Static tests at
–55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
–55
7
Functional tests at
25
8A
Functional tests at
125
8B
Functional tests at
–55
9
Switching tests at
25
10
Switching tests at
125
11
Switching tests at
–55
12
Setting time at
25
13
Setting time at
125
14
Setting time at
–55



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