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STM32H533CE 데이터시트(PDF) 202 Page - STMicroelectronics

부품명 STM32H533CE
상세설명  Arm® Cortex®-M33 32-bit MCUTrustZone® FPU, 375 DMIPS 250 MHz, 512-Kbyte flash, 272-Kbyte RAM, cryptography
PDF  231 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H533CE 데이터시트(HTML) 202 Page - STMicroelectronics

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Package information
STM32H533xx
202/231
DS14539 Rev 1
6.2
WLCSP39 package information (B0MM)
This WLCSP is a 39-ball, 2.76 x 2.78 mm, 0.4 mm pitch, wafer level chip scale array
package.
Figure 60. WLCSP39 - Outline
1. Drawing is not to scale.
2. The A1 corner must be identified on the top surface of the package by using a marking or a physical
feature. A distinguish feature is allowable on the bottom surface of the package to identify the A1 corner.
Exact shape of each corner is optional.
B0MM_WLCSP39_ME_V1
E
D1
D
E1
SE
SD
e
BOTTOM VIEW
E
D
TOP VIEW
(Datum B)
(Datum A)
A1 ball pad corner
A1 ball pad corner
Øb (39 balls)
ddd
C A B
eee
Ø
Ø
M
M
C
A
B
C
D
E
G
F
(Datum A)
(Datum B)
11
10
9
8
7
6
5
4
3
2
1
aaa (4X)
c
A
A3
A2
C
A1
A
Seating plane
SIDE VIEW
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
G
F
Back side coating
Silicon
Solder balls



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