STM32H533CE datasheet(203/231 Pages) STMICROELECTRONICS

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DS14539 Rev 1

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STM32H533xx

Package information

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Table 120. WLCSP39 - Mechanical data

Symbol

Millimeters

Inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

A(2)

2. The profile height, A, is the distance from the seating plane to the highest point on the package. It is

measured perpendicular to the seating plane.

0.58

0.0228

A1(3)

3. A1 is defined as the distance from the seating plane to the lowest point on the package body.

0.17

0.0067

0.38

0.0150

0.025

0.0010

b(4)

4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to datum C.

0.23

0.26

0.28

0.0091

0.0102

0.0110

D2.76 BSC(5)

5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance.

0.1087 BSC

2.000 BSC

0.0787 BSC

2.78 BSC

0.1094 BSC

2.078 BSC

0.0818 BSC

e(6)

6. e represents the solder balls grid pitch(es).

0.40 BSC

0.0157 BSC

SD(7)

7. Basic dimensions SD and SE are defining the ball matrix position with respect to datums A and B.

0.200 BSC

0.0079 BSC

SE(7)

0.346 BSC

0.0136 BSC

N39(8)

8. N represents the total number of balls.

aaa(9)

9. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

0.02 BSC

0.0008 BSC

bbb(9)

0.06 BSC

0.0024 BSC

ccc(9)

0.03 BSC

0.0012 BSC

ddd(9)

0.015 BSC

0.0006 BSC

eee(9)

0.05 BSC

0.0020 BSC

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