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TMS320DM647_0804 데이터시트(PDF) 179 Page - Texas Instruments

부품명 TMS320DM647_0804
상세설명  Digital Media Processor
PDF  182 Pages
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제조업체  TI [Texas Instruments]
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TMS320DM647_0804 데이터시트(HTML) 179 Page - Texas Instruments

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7
Mechanical Data
7.1 Thermal Data for ZUT
7.1.1 Packaging Information
TMS320DM647/TMS320DM648
Digital Media Processor
www.ti.com
SPRS372B – MAY 2007 – REVISED APRIL 2008
The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.
See Power Application Report.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]
°C/W(1)
AIR FLOW (m/s)(2)
R
ΘJC
R
ΘJC Junction-to-case
1.7
N/A
R
ΘJB
R
ΘJB Junction-to-board
8.6
N/A
R
ΘJA
R
ΘJA Junction-to-free air
17.2
0.0
13.7
1.0
12.4
2.0
11.5
3.0
ψ
JT
ψJT Junction-to-package top
0.6
0.0
0.6
1.0
0.6
2.0
0.7
3.0
ψi
JB
ψJB Junction-to-board
8.4
0.0
7.4
1.0
7.0
2.0
6.7
3.0
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2)
m/s = meters per second
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Submit Documentation Feedback
Mechanical Data
179



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