47

3638F–DFLASH–4/08

AT45DB021D

26. Ordering Information

26.1

Ordering Code Detail

Notes:

1. The shipping carrier option is not marked on the devices.

2. Standard parts are shipped with the page size set to 264 bytes. The user is able to configure these parts to a 256-byte page

size if desired.

3. Parts ordered with suffix SL954 are shipped in bulk with the page size set to 256 bytes. Parts will have a 954 or SL954

marked on them.

4. Parts ordered with suffix SL955 are shipped in tape and reel with the page size set to 256 bytes. Parts will have a 954 or

SL954 marked on them.

AT 4 5 D

0 2

SS HB

1D–

–

B

Atmel Designator

Product Family

Device Density

02 = 2-megabit

Interface

1 = Serial

Package Option

M = 8-lead, 6 x 5 x 0.6 mm UDFN

SS = 8-lead, 0.150" wide SOIC

S

= 8-lead, 0.209" wide SOIC

Device Grade

H = NiPdAu lead finish, industrial

temperature range (-40°C to +85°C)

Shipping Carrier Option

B = Bulk (tubes)

Y = Trays

T = Tape and reel

Device Revision

26.2

Green Package Options (Pb/Halide-free/RoHS Compliant)

Ordering Code(1)(2)

Package

Lead Finish

Operating Voltage

f

Operation Range

AT45DB021D-MH-Y

AT45DB021D-MH-T

AT45DB021D-MH-SL954(3)

AT45DB021D-MH-SL955(4)

8MA1

NiPdAu

2.7V to 3.6V

66

Industrial

(-40°C to +85°C)

AT45DB021D-SSH-B

AT45DB021D-SSH-T

AT45DB021D-SSH-SL954(3)

AT45DB021D-SSH-SL955(4)

8S1

AT45DB021D-SH-B

AT45DB021D-SH-T

AT45DB021D-SH-SL954(3)

AT45DB021D-SH-SL955(4)

8S2

Package Type

8MA1

8-lead (6 x 5 x 0.6 mm Body), Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)

8S1

8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)

8S2

8-lead, 0.209” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)