PCIMX258CJM4A datasheet(140/144 Pages) FREESCALE

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 3

140

Freescale Semiconductor

Revision History

Table 106 summarizes revisions to this document.

Table 106. Revision History

Rev.

Date

Revision

04/2010 • Updated Table 1, “Ordering Information,” to include new part numbers.

• Added Table 2, “i.MX25 Parts Functional Differences.”

• Added Section 3.3, “Power Characteristics.”

• Added Section 4.5, “347 MAPBGA—Case 12x12 mm, 0.5 mm Pitch.”

• Added Section 4.6, “Ground, Power, Sense, and Reference Contact Assignments Case 12x12 mm,

0.5 mm Pitch.”

• Added Section 4.7, “Signal Contact Assignments—12x12 mm, 0.5 mm Pitch.”

• Added Section 4.8, “i.MX25 12x12 Package Ball Map.”

12/2009 • Updated Table 1, “Ordering Information,” to include new part numbers.

10/2009 • Updated Table 1, “Ordering Information,” to include new part numbers.

• Updated DRYICE description in Table 3, “i.MX25 Digital and Analog Modules.”

• Updated REF signal description in Table 4, “Signal Considerations.”

• Updated ESD damage immunity values in Table 5, “DC Absolute Maximum Ratings.”

• Updated values in Table 11, “i.MX25 Power Mode Current Consumption.”

• Added a note on timing in Section 3.2.1, “Power-Up Sequence.”

• Added Table 12, “iMX25 Reduced Power Mode Current Consumption.”

• Updated Table 53, “NFC Timing Parameters.”

• Updated values in Table 54, “WEIM Bus Timing Parameters.

• Updated Table 83, “Touchscreen ADC Electrical Specifications.”

6/2009 Initial release.

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