360J datasheet(35/68 Pages) INTEL

부품명	360J

상세설명	Celeron M Processor on 90 nm Process

PDF	68 Pages

Scroll/Zoom	100%

제조업체	INTEL [Intel Corporation]

홈페이지	http://www.intel.com

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35 / 68 page

Datasheet

Package Mechanical Specifications and Pin Information

NOTES:

Overall height as delivered. Values are based on design specifications and tolerances. This

dimension is subject to change based on OEM motherboard design or OEM SMT process

Table 13.

Micro-FCPGA Package Dimensions

Symbol

Parameter

Min

Max

Unit

Overall height, as delivered (Refer to Note 1)

2.60

2.85

Die height

0.82

Ball diameter

0.78

Package substrate length

34.9

35.1

Package substrate width

34.9

35.1

Die length

12.54

Die width

6.99

eBall pitch

1.27

Package edge keep-out

Package corner keep-out

Die-side capacitor height

–

0.7

Package edge to first ball center

1.625

Ball count

479

each

–

Solder ball coplanarity

0.2

Pdie

Allowable pressure on the die for thermal solution

–

689

kPa

WPackage weight

4.5

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