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Datasheet

Thermal Specifications and Design Considerations

NOTES:

The Thermal Design Power (TDP) specification should be used to design the processor thermal solution.

The TDP is not the maximum theoretical power the processor can dissipate.

Not 100% tested. These power specifications are determined by characterization of the processor currents

at higher temperatures and extrapolating the values for the temperature indicated.

As measured by the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to

indicate that the maximum TJ has been reached. Refer to Section 5.1 for more details.

The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within

specifications.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features

within each processor family, not across different processor families. See www.intel.com/products/

processor_number for details.

See Table 4 for VCC2 and VCC3.

5.1

Thermal Specifications

5.1.1

Thermal Diode

The Celeron M processor incorporates two methods of monitoring die temperature, the

Intel Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in

Section 5.1) must be used to determine when the maximum specified processor

junction temperature has been reached. The second method, the thermal diode, can be

read by an off-die analog/digital converter (a thermal sensor) located on the

motherboard, or a stand-alone measurement kit. The thermal diode may be used to

monitor the die temperature of the processor for thermal management or

instrumentation purposes but cannot be used to indicate that the maximum TJ of the

processor has been reached. When using the thermal diode, a temperature offset value

must be read from a processor Model Specific register (MSR) and applied. See

Section 5.1.2 for more details. Please see Section 5.1.3 for thermal diode usage

recommendation when the PROCHOT# signal is not asserted. Table 18 and Table 19

provide the diode interface and specifications.

Note:

The reading of the external thermal sensor (on the motherboard) connected to the

processor thermal diode signals, will not necessarily reflect the temperature of the

hottest location on the die. This is due to inaccuracies in the external thermal sensor,

on-die temperature gradients between the location of the thermal diode and the hottest

location on the die, and time based variations in the die temperature measurement.

Time based variations can occur when the sampling rate of the thermal diode (by the

thermal sensor) is slower than the rate at which the TJ temperature can change.

PDSLP

Deep Sleep Power at:

At 35°C,

Note 2,5,6

390

VCC2

8.8

380

VCC2

8.8

370

VCC2

8.8

360J

VCC2

8.8

360

1.260 V

8.8

350J

VCC2

8.8

350

1.260 V

8.8

383

VCC3

1.4

373

VCC3

1.4

353

0.940 V

1.4

Junction Temperature

100

°CNotes 3, 4

Table 17.

Power Specifications for the Celeron M Processor (Sheet 2 of 2)

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