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WM9093ECS/R 데이터시트(PDF) 82 Page - Wolfson Microelectronics plc

부품명 WM9093ECS/R
상세설명  Ultra Low Power Audio Subsystem
PDF  84 Pages
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제조업체  WOLFSON [Wolfson Microelectronics plc]
홈페이지  http://www.wolfsonmicro.com
Logo WOLFSON - Wolfson Microelectronics plc

WM9093ECS/R 데이터시트(HTML) 82 Page - Wolfson Microelectronics plc

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WM9093
Production Data
w
PD, March 2012, Rev 4.2
82
PACKAGE DIMENSIONS
B: 20 BALL W-CSP PACKAGE 2.500 X 2.000 X 0.7mm BODY, 0.50 mm BALL PITCH
A1
CORNER
TOP VIEW
E
Z
0.10
2 X
D
5
4
DETAIL 2
DETAIL 2
A
A2
2
Z
0.10
2 X
A1
Z
bbb
Z
1
SOLDER BALL
E1
A
D1
DETAIL 1
D
C
B
e
e
1
5
4
32
6
f1
f2
g
h
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
A1
0.219
D
D1
E
E1
e
2.000 BSC
2.000
0.250
1.500 BSC
0.500 BSC
2.500
Dimensions (mm)
Symbols
MIN
NOM
MAX
NOTE
A
0.700
A2
0.391
0.416
0.441
5
f1
0.754
0.646
0.244
0.269
g
0.040
0.036
0.044
h
0.314 BSC
BOTTOM VIEW
0.270
f2
DETAIL 1
DM086.A
2.560
2.100



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