| 전자부품 데이터시트 검색엔진 |
|
MPC8347VRAGDB 데이터시트(PDF) 56 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC8347VRAGDB 데이터시트(HTML) 56 Page - Freescale Semiconductor, Inc |
|
56 / 99 page ![]() MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12 56 Freescale Semiconductor Package and Pin Listings 18.2 Mechanical Dimensions for the MPC8347EA TBGA Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA, 672-TBGA package. Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA TBGA Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement must exclude any effect of mark on top surface of package. |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |