UPD30121 datasheet(72/76 Pages) NEC

72 / 76 page

Data Sheet U14691EJ1V0DS00

µµµµPD30121

4. RECOMMENDED SOLERING CONDITIONS

The

µPD30121 should be soldered and mounted under the following recommended conditions.

For details of recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 4-1. Surface Mounting Type Soldering Conditions

µµµµPD30121F1-131-GA1: 224-pin plastic FBGA (16 ×××× 16)

µµµµPD30121F1-168-GA1: 224-pin plastic FBGA (16 ×××× 16)

Soldering

Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 230

°C, Time: 30 seconds max. (at 210°C or

higher), Count: 2 times max., Exposure limit: 3 days

Note (after that, prebake at

125

°C for 10 to 72 hours.)

IR30-103-2

VPS

Package peak temperature: 215

°C, Time: 25 to 40 seconds (at 200°C or

higher), Count: 2 times max. , Exposure limit: 3 days

Note (after that, prebake at

125

°C for 10 to 72 hours.)

VP15-103-2

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin row)



Note

After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

UPD30121 데이터시트(PDF) 72 Page - NEC