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UT700 데이터시트(PDF) 43 Page - Aeroflex Circuit Technology |
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UT700 데이터시트(HTML) 43 Page - Aeroflex Circuit Technology |
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43 / 46 page ![]() 43 36-00-00-000 Ver. 1.3.1 Aeroflex Microelectronics Solutions - HiRel 7.0 Ordering Information UT700 LEON 3FT Package Option Associated Lead Finish (Z) 484-CLGA (C) Gold (S) 484-CCGA (A) Hot Solder Dipped (C) 484-CBGA (A) Hot Solder Dipped Lead Finish: (NOTE 1) (C) = Gold (A) = Hot Solder Dipped or Tinned Screening Level: (NOTE 2 & 3) (P) = Prototype (Temperature Range: 25oC only) (E) = HiRel (Temperature Range: -55 oC to +105oC) Case Outline: (Z) = 484-Ceramic Land Grid Array (S) = 484-Ceramic Column Grid Array (C) = 484-Ceramic Ball Grid Array UT700 32-bit LEON 3FT UT700 - * * * Notes: 1. Lead finish (A or C) must be specified. 2. Prototype Flow per Aeroflex Manufacturing Flows Document. Devices are tested at 25oC only. Radiation is neither tested nor guaranteed. 3. HiRel Flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed. |
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