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UT700 데이터시트(PDF) 46 Page - Aeroflex Circuit Technology

부품명 UT700
상세설명  UT700 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor
PDF  46 Pages
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제조업체  AEROFLEX [Aeroflex Circuit Technology]
홈페이지  http://www.aeroflex.com
Logo AEROFLEX - Aeroflex Circuit Technology

UT700 데이터시트(HTML) 46 Page - Aeroflex Circuit Technology

Back Button UT700 Datasheet HTML 38Page - Aeroflex Circuit Technology UT700 Datasheet HTML 39Page - Aeroflex Circuit Technology UT700 Datasheet HTML 40Page - Aeroflex Circuit Technology UT700 Datasheet HTML 41Page - Aeroflex Circuit Technology UT700 Datasheet HTML 42Page - Aeroflex Circuit Technology UT700 Datasheet HTML 43Page - Aeroflex Circuit Technology UT700 Datasheet HTML 44Page - Aeroflex Circuit Technology UT700 Datasheet HTML 45Page - Aeroflex Circuit Technology UT700 Datasheet HTML 46Page - Aeroflex Circuit Technology  
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36-00-00-000
Ver. 1.3.1
Aeroflex Microelectronics Solutions - HiRel
DATA SHEET REVISION HISTORY
Revision &
Date
Description of Change
11/19/13
Ver. 1.0.0
Release of Preliminary Data Sheet
8/26/14
Ver. 1.1.0
Release Production Datasheet
Page 1: Corrected SEL Immune
Page 17: Corrected VDDC, VDD limits, and note 3 temperature
Page 18: Moved Operational Environment table from section 5 to 3.3 and updated
Page 19: Added IDDCS, IDDS limits from TBD
Page 20: Added IIN and IIN limits (to bound the range for pull up/down resistors)
Page 22: Corrected tDSD limits
Page 23: Corrected IIN and IOZ limits
Page 32: Corrected symbols t14, t15, t16, and the corresponding timing diagrams
Page 39: Moved the Operational Environment table to section 3.3 on page 18
Pages 40-42: Corrected package drawings
11/21/14
1.2.0
Page 2: Changed Figure 1 Data and Instr Cache Values from 2x4kB to 4x4kB
Page 16: Added GPIO[2] entry to Bootstrap signals table.
Page 28:Re-wrote section 4.1.4
Page 43:Corrected SMD lead finish designator.
Page All: Added Footer
March 2015
Ver. 1.3.1
Page 17: Removed note 3 and changed the maximum junction temperature value from 125°C to 150°C in the
Absolute Maximum Ratings Table.
Page 26: Rewrote section 4.1.1 on power sequencing.



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