44

36-00-00-000

Ver. 1.3.1

Aeroflex Microelectronics Solutions - HiRel

UT700 LEON 3FT: SMD

Lead Finish: (NOTE 1)

(C)

=

Gold

(F)

=

Solder

Case Outline:

(X) =

484-Ceramic Land Grid Array Package

(Y) =

484-Ceramic Column Grid Array

Screening Level:

(Q) =

QML Class Q

Device Type: (NOTE 2)

(01) =

(02) =

UT700 Assembled to Aeroflex’s Q+ Flow (Temp range: -55

Drawing Number:

13238

Total Dose:

(R)

=

1E5 rad(Si)

Federal Stock Class Number: No Options

5962

*

13238

**

*

*

*

Notes:

1. Lead finish is “C” (gold) only.

2.Aeroflex’s Q+ assembly flow, as defined in section 4.2.2.d of the SMD, provides QML-Q product through the SMD that is manufactured with Aerof-

lex’s standard QML-V flow, and has completed QML-V qualification per MIL-PRF-38535.