| 전자부품 데이터시트 검색엔진 |
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AD6679 데이터시트(PDF) 18 Page - Analog Devices |
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AD6679 데이터시트(HTML) 18 Page - Analog Devices |
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18 / 81 page ![]() AD6679 Data Sheet Rev. B | Page 18 of 81 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD1 to AGND 1.32 V AVDD2 to AGND 2.75 V AVDD3 to AGND 3.63 V DVDD to DGND 1.32 V DRVDD to DRGND 1.32 V SPIVDD to AGND 3.63 V AGND to DRGND −0.3 V to +0.3 V VIN±x to AGND 3.2 V SCLK, SDIO, CSB to AGND −0.3 V to SPIVDD + 0.3 V PDWN/STBY to AGND −0.3 V to SPIVDD + 0.3 V Environmental Operating Temperature Range −40°C to +85°C Maximum Junction Temperature +125°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL CHARACTERISTICS Typical θJA, ΨJB, and ΨJT are specified vs. the number of printed circuit board (PCB) layers in different airflow velocities (in m/sec). Airflow increases heat dissipation, effectively reducing θJA and ΨJB. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. Thermal performance for actual applications requires careful inspection of the conditions in an application. The use of appropriate thermal management techniques is recom- mended to ensure that the maximum junction temperature does not exceed the limits shown in Table 6. Table 7. Thermal Resistance PCB Type Airflow Velocity (m/sec) θJA ΨJT ΨJB Unit JEDEC 2s2p Board 0.0 27.01, 2 0.71, 3 7.31, 3 °C/W 1 Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per JEDEC JESD51-8 (still air). ESD CAUTION |
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