AD9652BBCZ-310 datasheet(9/36 Pages) AD

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Data Sheet

AD9652

Rev. A | Page 9 of 36

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD3 to AGND

−0.3 V to +3.6 V

AVDD_CLK to AGND

−0.3 V to +2.0 V

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

SPIVDD to AGND

−0.3 V to +3.6 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

1.2 V to 3.0 V

CLK+, CLK− to AGND

−0.3 V to AVDD_CLK +

0.2 V

SYNC to AGND

−0.3 V to AVDD_CLK +

0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to SPIVDD + 0.3 V

SCLK to AGND

−0.3 V to SPIVDD + 0.3 V

SDIO to AGND

−0.3 V to SPIVDD + 0.3 V

PDWN to AGND

−0.3 V to DRVDD + 0.3 V

OR+/OR− to AGND

−0.3 V to DRVDD + 0.3 V

D0± Through D15± to AGND

−0.3 V to DRVDD + 0.3 V

DCO± to AGND

−0.3 V to DRVDD + 0.3 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

125°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

Typical θJA is specified for both a 4-layer printed circuit board

(PCB) with a solid ground plane from the JEDEC 51-2 and an

8-layer PCB. The 8-layer PCB has 2 oz copper layers (M1 and

M8), 1 oz copper inner layers, and vias connecting to layers M2,

M5, and M7.

As shown in Table 7, airflow increases heat dissipation, which

reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

Board Type

θJA2

Unit

144-Ball CSP_BGA

10 mm × 10 mm

(BC-144-6)

8-layer PCB

15.8

°C/W

1.0

8-layer PCB

13.9

°C/W

JEDEC1

21.7

°C/W

1.0

JEDEC1

19.2

°C/W

1 Per JEDEC JESD51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

ESD CAUTION

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