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AS4C64M8D2 데이터시트(PDF) 52 Page - Alliance Semiconductor Corporation |
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AS4C64M8D2 데이터시트(HTML) 52 Page - Alliance Semiconductor Corporation |
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52 / 59 page ![]() AS4C64M8D2 Confidential 52 Rev. 1.0 Feb. /2014 Figure 44. Self refresh operation CK# CK CKE T0 T1 T5 Tm T2 T3 CMD >=tXSNR tRP* tCH tCL tCK T4 T6 Tn >=tXSRD tIS VIL(ac) VIH(ac) tIS NOP Self Refresh ODT tAOFD tIS VIL(ac) tIH tIS tIH tIS tIH VIL(dc) VIL(ac) VIH(ac) VIH(dc) NOP NOP Valid NOTE 1 Device must be in the "All banks idle" state prior to entering Self Refresh mode. NOTE 2 ODT must be turned off tAOFD before entering Self Refresh mode, and can be turned on again when tXSRD timing is satisfied. NOTE 3 tXSRD is applied for Read or a Read with autoprecharge command. tXSNR is applied for any command except a Read or a Read with autoprecharge command. Figure 45. Basic power down entry and exit timing diagram CK# CK Command CKE VALID tIH tCKE min tIH tIH tIH tIS tIS tIS NOP NOP NOP VALID VALID or NOP tXP, tXARD tXARDS tCKE(min) Exit Power-Down mode Don't Care Enter Power-Down mode Figure 46. CKE intensive environment CK# CKE tCKE NOTE: DRAM guarantees all AC and DC timing & voltage specifications and proper DLL operation with intensive CKE operation CK tCKE tCKE tCKE |
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