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MB9BF412RPMC-G-JNE2 데이터시트(PDF) 108 Page - Cypress Semiconductor

부품명 MB9BF412RPMC-G-JNE2
상세설명  32-bit Arm짰 Cortex짰-M3 FM3 Microcontroller
PDF  112 Pages
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제조업체  CYPRESS [Cypress Semiconductor]
홈페이지  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

MB9BF412RPMC-G-JNE2 데이터시트(HTML) 108 Page - Cypress Semiconductor

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Document Number: 002-05615 Rev. *D
Page
108 of 112
MB9B410R Series
Package Type
Package Code
FBGA 112
LBC112
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,
DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
"SD" AND "SE" ARE MEASUREDWITH RESPECT TO DATUMS A AND B AND
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
"e" REPRESENTS THE SOLDER BALL GRID PITCH.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A
SOLDER BALL POSITION DESIGNATIO
N PER JEP95, SECTION 3, SPP-020.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER
A1 CORNER TO BE IDENTIFIED BY
CHAMFER, LASER OR INK MARK
8.
7.
6.
NOTES:
5.
4.
3.
2.
1. ALL DIMENSIONS ARE IN MILLIMETERS.
SD
b
eE
eD
ME
N
0.35
0.00
0.80 BSC
0.80 BSC
0.45
112
11
0.55
DIMENSIONS
D1
MD
E1
E
D
A
A1
SYMBOL
0.25
MIN.
-
8.00 BSC
8.00 BSC
11
10.00 BSC
10.00 BSC
NOM.
-
1.45
0.45
MAX.
SE
0.00
0.35
METALIZED MARK, INDENTATION OR OTHER MEANS.
"SD" = eD/2 AND "SE" = eE/2.
PLANE PARALLEL TO DATUM C.
"SD" OR "SE" = 0.
SIZE MD X ME.
BALLS.
A
0.20 C
2X
B
0.20 C
2X
INDEX MARK
PIN A1
CORNER
7
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
G
H
J
K
L
112x
φb
0.08
C A B
5
6
6
SIDE VIEW
0.10 C
C
DETAIL A
BOTTOM VIEW
TOP VIEW
DETAIL A
10.00X10.00X1.45 MM LBC112 REV**
PACKAGE OUTLINE, 112 BALL FBGA
002-13225 **



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