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STM32H533CE 데이터시트(PDF) 122 Page - STMicroelectronics |
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STM32H533CE 데이터시트(HTML) 122 Page - STMicroelectronics |
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122 / 231 page ![]() Electrical characteristics STM32H533xx 122/231 DS14539 Rev 1 Note: For information on selecting the crystal, refer to AN2867 “Oscillator design guide for ST microcontrollers”, available from www.st.com. Figure 19. Typical application with a 32.768 kHz crystal Note: An external resistor is not required between OSC32_IN and OSC32_OUT, and it is forbidden to add one. 5.3.8 Internal clock source characteristics The parameters given in Table 43 to Table 46 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 20. 48 MHz high-speed internal RC oscillator (HSI48) Gmcritmax Maximum critical crystal gm LSEDRV[1:0] = 01 Medium low drive capability - - 0.75 µA/V LSEDRV[1:0] = 10 Medium high drive capability -- 1.7 LSEDRV[1:0] = 11 High drive capability -- 2.7 tSU(LSE)(3) Startup time VDD is stabilized - 2 - s 1. Specified by design - Not tested in production. 2. Refer to the note and caution paragraphs below the table, and to AN2867 “Oscillator design guide for ST microcontrollers”. 3. tSU(LSE) is the startup time measured from the moment it is enabled (by software) to when a stabilized 32.768 kHz oscillation is reached. This value is measured for a standard crystal and can vary significantly with the crystal manufacturer Table 42. Low-speed external user clock characteristics(1) (continued) Symbol Parameter Conditions(2) Min Typ Max Unit ai17531d STM32 OSC32_OUT fLSE CL1 RF 32.768 kHz resonator Bias controlled gain OSC32_IN CL2 Resonator with integrated capacitors Table 43. HSI48 oscillator characteristics Symbol Parameter Conditions Min Typ Max Unit fHSI48 HSI48 frequency VDD = 3.3 V, TJ= 30 °C 47.5(1) 48 48.5(1) MHz TRIM(3) User trimming step - - 0.175 0.250 % USER TRIM COVERAGE(2) User trimming coverage ±32 steps ±4.70 ±5.6 - DuCy(HSI48)(3) Duty cycle - 45 - 55 % |
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