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STLS2F01 데이터시트(PDF) 46 Page - STMicroelectronics |
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STLS2F01 데이터시트(HTML) 46 Page - STMicroelectronics |
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46 / 48 page ![]() Package information STLS2F01 46/48 9 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 14. HFCBGA452 mechanical data & package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 3.150 0.1240 A1 0.250 0.0098 A3 1.300 0.0512 A4 1.000 0.0394 b 0.450 0.500 0.550 0.0177 0.0197 0.0217 D 26.800 27.000 27.200 1.0551 1.0630 1.0709 D1 25.000 0.9843 E 26.800 27.000 27.200 1.0551 1.0630 1.0709 E1 25.000 0.9843 e 1.000 0.0394 F 1.000 0.0394 aaa 0.200 0.0079 ddd 0.200 0.0079 eee 0.250 0.0098 fff 0.100 0.0039 HFCBGA452 (27x27x2.9mm) Heat Spreader Flip Chip Ball Grid Array 8061758 A |
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