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STM32F102X8 데이터시트(PDF) 74 Page - STMicroelectronics

부품명 STM32F102X8
상세설명  Medium-density USB access line, ARM-based 32b MCU with 64/128KB Flash, USB FS, 6 timers, ADC & 8 com. interfaces
PDF  80 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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STM32F102X8 데이터시트(HTML) 74 Page - STMicroelectronics

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Package characteristics
STM32F102x8, STM32F102xB
74/80
DocID15056 Rev 5
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 8: General operating conditions on page 30.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × ΘJA)
Where:
•
TA max is the maximum ambient temperature in °C,
•ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.3
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 52. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm / 0.5 mm pitch
55
°C/W
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45



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