STM32F303VE datasheet(16/184 Pages) STMICROELECTRONICS

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Functional overview

STM32F303xD STM32F303xE

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DocID026415 Rev 4

3.4

Embedded SRAM

STM32F303xD/E devices feature 80 Kbytes of embedded SRAM with hardware parity

check. The memory can be accessed in read/write at CPU clock speed with 0 wait states,

allowing the CPU to achieve 90 Dhrystone MIPS at 72 MHz (when running code from the

CCM (Core Coupled Memory) RAM).

•

16 Kbytes of CCM SRAM mapped on both instruction and data bus, used to execute

critical routines or to access data (parity check on all of CCM SRAM).

•

64 Kbytes of SRAM mapped on the data bus (parity check on first 32 Kbytes of SRAM).

3.5

Boot modes

At startup, Boot0 pin and Boot1 option bit are used to select one of three boot options:

•

Boot from user Flash

•

Boot from system memory

•

Boot from embedded SRAM

The boot loader is located in the system memory. It is used to reprogram the Flash memory

by using USART1 (PA9/PA10), USART2 (PA2/PA3) or USB (PA11/PA12) through DFU

(device firmware upgrade).

3.6

Cyclic redundancy check (CRC)

The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a

configurable generator polynomial value and size.

Among other applications, CRC-based techniques are used to verify data transmission or

storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of

verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of

the software during runtime, to be compared with a reference signature generated at

linktime and stored at a given memory location.

STM32F303VE 데이터시트(PDF) 16 Page - STMicroelectronics