ST7MC1K2 datasheet(326/371 Pages) STMICROELECTRONICS

326 / 371 page

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Electrical characteristics

ST7MC1K2-Auto, ST7MC1K6-Auto, ST7MC2S4-Auto, ST7MC2S6-Auto

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Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical application

environment and simplified MCU software. It should be noted that good EMC performance is highly

dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and prequalification tests

in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

●

Corrupted program counter

●

Unexpected reset

●

Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be reproduced by

manually forcing a low state on the RESET pin or the Oscillator pins for 1 second.

To complete these trials, ESD stress can be applied directly on the device, over the range of specification

values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable

errors occurring (see application note AN1015).

Table 205.

EMS test results

Symbol

Parameter

Conditions

Level/class

VFESD

Voltage limits to be applied

on any I/O pin to induce a

functional disturbance

Flash/ROM devices

VDD =5V, TA = +25°C, fOSC =8 MHz,

LVD OFF,

Conforms to IEC 1000-4-2

VDD =5V, TA = +25°C, fOSC =8 MHz,

LVD ON,

Conforms to IEC 1000-4-2

VFFTB

Fast transient voltage burst

limits to be applied through

100pF on VDD and VDD pins

to induce a functional

disturbance

Flash devices

VDD =5V, TA = +25°C, fOSC =8 MHz,

Conforms to IEC 1000-4-4

ROM devices

VDD =5V, TA = +25°C, fOSC =8 MHz,

Conforms to IEC 1000-4-4

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