DSP56600FMSLASHAD datasheet(63/76 Pages) NXP

63 / 76 page

Preliminary

MOTOROLA

DSP56651 Technical Data Sheet

3-1

SECTION

PACKAGING

PACKAGE INFORMATION

This section provides information about the available packages for this product. The

DSP56651 is available in a 196-pin plastic ball grid array (PBGA) package.

The DSP56651 part (RAM-based DSP program memory) is delivered in a 17-mm

(outline) PBGA

package having a solder-ball footprint identical to that of the

15 mm PBGA. Compatibility between the footprints of the two packages is

maintained to minimize impact to the customer’s application board routing, such

that the same board can be used for both the DSP56651 and DSP56652.

196 PBGA (GT), 17 x 17 mm, with Footprint of 15-mm PBGA

The DSP56651 is offered in the non-JEDEC standard, 17-mm PBGA package. The

package is “non-standard” in that the single outermost row of solder balls in the

array is removed, leaving a 14 x 14 array (196) of solder balls. This package footprint

is identical to that of the JEDEC standard 15 mm (outline) 196 PBGA. The pitch of the

solder balls is 1 mm. Refer to the following table and figure for package drawing

and dimensions.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

DSP56600FM/AD 데이터시트(PDF) 63 Page - NXP Semiconductors