DSP56600FMSLASHAD datasheet(69/76 Pages) NXP

69 / 76 page

Design Considerations

Electrical Design Considerations

Preliminary

MOTOROLA

DSP56651 Technical Data Sheet

4-3

ELECTRICAL DESIGN CONSIDERATIONS

Use the following list of recommendations to assure correct DSP operation:

•

Provide a low-impedance path from the board power supply to each VCC pin

on the DSP and from the board ground to each GND pin.

•

Use at least four 0.1

µF bypass capacitors positioned as close as possible to the

four sides of the package to connect the VCC power source to GND.

•

Ensure that capacitor leads and associated printed circuit traces that connect

to the chip VCC and GND pins are less than 0.5 inch per capacitor lead.

•

Use at least a four-layer printed circuit board (PCB) with two inner layers for

VCC and GND.

•

Because the DSP output signals have fast rise and fall times, PCB trace lengths

should be minimal. This recommendation particularly applies to the address

and data buses as well as the R/W, DSP_IRQ, and INT0–INT7 signals.

•

Consider all device loads as well as parasitic capacitance due to PCB traces

when calculating capacitance. This is especially critical in systems with higher

capacitive loads that could create higher transient currents in the VCC and

GND circuits.

•

All inputs must be terminated (i.e., not allowed to float) using CMOS levels.

•

Take special care to minimize noise levels on the PLL supply pins (both VCC

and GND).

CAUTION

This device contains protective circuitry to

guard against damage due to high static

voltage or electrical fields. However, normal

precautions are advised to avoid application

of any voltages higher than maximum rated

voltages

this

high-impedance

circuit.

Reliability of operation is enhanced if unused

inputs are tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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