STM32WB09XE datasheet(36/73 Pages) STMICROELECTRONICS

36 / 73 page

6.2

Absolute maximum ratings

Stresses above the absolute maximum ratings listed in the tables below, may cause permanent damage to the

device. These are stress ratings only and functional operation of the device at these conditions is not implied.

Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 10. Voltage characteristics

Symbol

Ratings

Min. Max. Unit

VDD1, VDD2, VDDRF, VDDSD

DC-DC converter supply voltage input and output

-0.3

+3.9

VCAP, VDDA

DC voltage on linear voltage regulator

-0.3 +1.32

FXTALOUT, FXTALIN

DC Voltage on HSE

-0.3 +1.32

PA0 to PA3, PA8 to PA11, PB0 to PB7, PB14 to PB15

DC voltage on digital input/output pins

-0.3

+3.9

VLXSD, VFBSD

DC voltage on analog pins

RCC_OSC32_OUT/PB12, RCC_OSC32_IN/PB13

DC voltage on XTA

-0.3

+3.6

RF1

DC voltage on RF pin

+1.4

|ΔVDD|

Variations between different VDDX

power pins of the same domain

Note:

All the main power and ground pins must always be connected to the external power supply, in the permitted

range.

Table 11. Current characteristics

Symbol

Ratings

Max.

Unit

ΣIVDD

Total current into sum of all VDD power lines (source)

130

ΣIVGND

Total current out of sum of all ground lines (sink)

130

IVDD(PIN)

Maximum current into each VDD power pin (source)

100

IVGND(PIN)

Maximum current out of each ground pin (sink)

100

IIO(PIN)

Output current sunk by any I/O and control pin

Output current sourced by any I/O and control pin

ΣIIO(PIN)

Total output current sunk by sum of all I/Os and control pins

100

Total output current sourced by sum of all I/Os and control pins

100

Σ|IIN(PIN)|

Total injected current (sum of all I/Os and control pins)

-5/0

Table 12. Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

-40 to -125

°C

Maximum junction temperature

125

STM32WB09xE

Electrical characteristics

DS14210 - Rev 6

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