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IMX53IEC 데이터시트(PDF) 1 Page - Freescale Semiconductor, Inc |
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IMX53IEC 데이터시트(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 173 page  Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 6, 03/2013 MCIMX53xC Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information See Table 1 on page 2 © 2011, 2012, 2013 Freescale Semiconductor, Inc. All rights reserved. 1 Introduction The i.MX53 processor features ARM Cortex™-A8 core, which operates at clock speeds as high as 800 MHz. It provides DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800 DRAM memories. The flexibility of the i.MX53 architecture allows for its use in a wide variety of applications. As the heart of the application chipset, the i.MX53 processor provides all the interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, hard drive, camera sensors, and dual displays. Features of the i.MX53 processor include the following: • Applications processor—The i.MX53xD processors boost the capabilities of high-tier portable applications by satisfying the ever increasing MIPS needs of operating systems and games. Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. i.MX53 Applications Processors for Industrial Products Silicon Version 2.1 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Functional Part Differences and Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16 4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16 4.2. Power Supply Requirements and Restrictions . . . 23 4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26 4.4. Output Buffer Impedance Characteristics . . . . . . 32 4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36 4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43 4.7. External Peripheral Interfaces Parameters . . . . . . 65 4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 141 5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142 5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 142 5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 143 5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 144 6. Package Information and Contact Assignments . . . . . 145 6.1. 19x19 mm Package Information . . . . . . . . . . . . . 145 7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 |
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