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AD9523-1/PCBZ 데이터시트(PDF) 12 Page - Analog Devices

부품명 AD9523-1/PCBZ
상세설명  Low Jitter Clock Generator
PDF  60 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
Logo AD - Analog Devices

AD9523-1/PCBZ 데이터시트(HTML) 12 Page - Analog Devices

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AD9523-1
Rev. B | Page 12 of 60
ABSOLUTE MAXIMUM RATINGS
Table 16.
Parameter
Rating
VDD3_PLL, VDD3_REF, VDD3_OUT[x:y],
LDO_VCO to GND
−0.3 V to +3.6 V
REFA, REFA, REFB, REFB to GND
−0.3 V to +3.6 V
SCLK/SCL, SDIO/SDA, SDO, CS to GND
−0.3 V to +3.6 V
OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
OUT3, OUT3, OUT4, OUT4, OUT5, OUT5,
OUT6, OUT6, OUT7, OUT7, OUT8, OUT8,
OUT9, OUT9, OUT10, OUT10, OUT11,
OUT11, OUT12, OUT12, OUT13, OUT13
to GND
−0.3 V to +3.6 V
SYNC, RESET, PD, REF_SEL to GND
−0.3 V to +3.6 V
STATUS0, STATUS1 to GND
−0.3 V to +3.6 V
SP0, SP1, EEPROM_SEL to GND
−0.3 V to +3.6 V
VDD1.8_OUT[x:y], LDO_PLL1, LDO_DIV_M1
to GND
2 V
Junction Temperature1
115°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature (10 sec)
300°C
1 See Table 17 for θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 17. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
θJA1, 2
θJC1, 3
θJB1, 4
Ψ
JT
1, 2
Unit
0
21.3
1.7
12.6
0.1
°C/W
1.0
20.1
0.2
°C/W
72-Lead LFCSP,
10 mm ×
10 mm
2.5
18.1
0.3
°C/W
1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Additional power dissipation information can be found in the
Power Dissipation and Thermal Considerations section.
ESD CAUTION



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