K32L2AX datasheet(84/96 Pages) NXP

84 / 96 page

8.9 Human-machine interfaces (HMI)

8.9.1 TSI electrical specifications

Table 53. TSI electrical specifications

Symbol

Description

Min.

Typ.

Max.

Unit

TSI_RUNF

Fixed power consumption in run mode

—

100

—

µA

TSI_RUNV

Variable power consumption in run mode

(depends on oscillator's current selection)

1.0

—

128

µA

TSI_EN

Power consumption in enable mode

—

100

—

µA

TSI_DIS

Power consumption in disable mode

—

1.2

—

µA

TSI_TEN

TSI analog enable time

—

µs

TSI_CREF

TSI reference capacitor

—

1.0

—

TSI_DVOLT

Voltage variation of VP & VM around nominal

values

0.19

—

1.03

9 Design considerations

9.1 Hardware design considerations

This device contains protective circuitry to guard against damage due to high static

voltage or electric fields. However, take normal precautions to avoid application of any

voltages higher than maximum-rated voltages to this high-impedance circuit.

9.1.1 Printed circuit board recommendations

• Place connectors or cables on one edge of the board and do not place digital circuits

between connectors.

• Drivers and filters for I/O functions must be placed as close to the connectors as

possible. Connect TVS devices at the connector to a good ground. Connect filter

capacitors at the connector to a good ground.

• Physically isolate analog circuits from digital circuits if possible.

• Place input filter capacitors as close to the MCU as possible.

• For best EMC performance, route signals as transmission lines; use a ground plane

directly under LQFP/MAPBGA packages.

Design considerations

K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021

NXP Semiconductors

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