IMX6SDLCEC datasheet(1/169 Pages) NXP

부품명	IMX6SDLCEC

상세설명	i.MX 6Solo/6DualLite Applications Processors for Consumer Products

PDF	169 Pages

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제조업체	NXP [NXP Semiconductors]

홈페이지	http://www.nxp.com

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMX6SDLCEC

Rev. 9, 11/2018

Package Information

Plastic Package

BGA Case 2240 21 x 21 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 3

NXP Reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products

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1

Introduction

The i.MX 6Solo/6DualLite processors represent the

latest achievement in integrated multimedia-focused

products offering high performance processing with

lower cost, as well as optimization for low power

consumption.

The processors feature advanced implementation of

single/dual Arm® Cortex®-A9 core, which operates at

speeds of up to 1 GHz. They include 2D and 3D graphics

processors, 1080p video processing, and integrated

power management. Each processor provides a 32/64-bit

DDR3/DDR3L/LPDDR2-800 memory interface and a

number of other interfaces for connecting peripherals,

such as WLAN, Bluetooth®, GPS, hard drive, displays,

and camera sensors.

The i.MX 6Solo/6DualLite processors are specifically

useful for applications such as:

•

Web and multimedia tablets

•

Web and multimedia tablets

i.MX 6Solo/6DualLite

Applications Processors

for Consumer Products

1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3

1.2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

1.3

Updated Signal Naming Convention . . . . . . . . . . . .9

2

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .10

2.1

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

3.1

Special Signal Considerations . . . . . . . . . . . . . . . .21

3.2

Recommended Connections for Unused Analog

Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

4

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .23

4.1

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .23

4.2

Power Supplies Requirements and Restrictions . .33

4.3

Integrated LDO Voltage Regulator Parameters . . .34

4.4

PLL’s Electrical Characteristics . . . . . . . . . . . . . . .36

4.5

On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .38

4.6

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .39

4.7

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .44

4.8

Output Buffer Impedance Parameters . . . . . . . . . .49

4.9

System Modules Timing . . . . . . . . . . . . . . . . . . . . .52

4.10 General-Purpose Media Interface (GPMI) Timing .64

4.11 External Peripheral Interface Parameters . . . . . . .72

5

Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .134

5.1

Boot Mode Configuration Pins . . . . . . . . . . . . . . .134

5.2

Boot Device Interface Allocation . . . . . . . . . . . . .135

6

Package Information and Contact Assignments . . . . . .136

6.1

Updated Signal Naming Convention . . . . . . . . . .136

6.2

21x21 mm Package Information. . . . . . . . . . . . . .137

7

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163

유사한 부품 번호 - IMX6SDLCEC

제조업체	부품명	데이터시트	상세설명
NXP Semiconductors	IMX6SDLAEC	3Mb / 169P	i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Rev. 9, 11/2018
NXP Semiconductors	IMX6SDLIEC	2Mb / 161P	i.MX 6Solo/6DualLite Applications Processors for Industrial Products Rev. 9, 11/2018

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