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IMX6SDLCEC 데이터시트(PDF) 137 Page - NXP Semiconductors |
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IMX6SDLCEC 데이터시트(HTML) 137 Page - NXP Semiconductors |
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137 / 169 page ![]() Package Information and Contact Assignments i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 9, 11/2018 NXP Semiconductors 137 Throughout this document, the updated signal names are used except where referenced as a ball name (such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to map the signal names used in older documentation to the new standardized naming conventions. 6.2 21x21 mm Package Information 6.2.1 Case 2240, 21 x 21 mm, 0.8 mm Pitch, 25 x 25 Ball Matrix Figure 101 shows the top, bottom, and side views of the 21×21 mm BGA package. |
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