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MPC821 데이터시트(PDF) 15 Page - NXP Semiconductors |
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MPC821 데이터시트(HTML) 15 Page - NXP Semiconductors |
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15 / 242 page ![]() Hardware Preparation and Installation MPC8XXFADS Design Specification—Rev 0.1 PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE FIGURE 2-10 PA2, PB2 - RS-232 Serial Port Connectors NOTE: The RTS line (pin 7) is not connected on the MPC8XXFADS. 2•4•9 Memory Installation The MPC8XXFADS is supplied with two types of memory SIMM: • Dynamic Memory SIMM • Flash Memory SIMM. To avoid shipment damage, these memories are packed aside rather than being installed in their sockets. Therefore, they should be installed on site. To install a memory SIMM, it should be taken out of its package, put diagonally in its socket (no error can be made here, since the Flash socket has 80 contacts, while the DRAM socket has 72) and then twisted to a vertical position until the metal lock clips are locked. See FIGURE 2-11 "Memory SIMM Installation" below. CAUTION The memory SIMMs have alignment nibble near their # 1 pin. It is important to align the memory cor- rectly before it is twisted, otherwise damage might be inflicted to both the memory SIMM and its sock- et. FIGURE 2-11 Memory SIMM Installation 1 TX 2 RX 3 RTS 4 CTS 5 DSR 6 GND 7 CD 8 9 N.C. DTR (1) (2) SIMM Socket Memory SIMM Metal Lock Clip Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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