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MPC821 데이터시트(PDF) 41 Page - NXP Semiconductors

부품명 MPC821
상세설명  Design Specification
PDF  242 Pages
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Functional Description
MPC8XXFADS Design Specification—Rev 0.1
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
ming" below:
4•8•1•1
SDRAM Initializing Procedure
After Power-up the SDRAM needs to be initialized in a certain manner, described below:
1)
UPMB should be programmed with values described in TABLE 3-8. "UPMB Initializations
for MB811171622A-100 upto 32MHz" on page 26 or in TABLE 3-9. "UPMB Initializations
for MB811171622A-100, 32+MHz - 50MHz" on page 27.
2)
Memory controller’s MPTPR, MBMR, OR4 and BR4 registers should be programmed ac-
cording to TABLE 3-6. "Memory Controller Initializations For 20Mhz" on page 22 or TABLE
3-3. "Memory Controller Initializations For 50Mhz" on page 19.
3)
MAR should be set with proper value (0x48 for upto 32MHz or 0x88 for 32 - 50 MHz)
4)
MCR should be written with 0x80808105 to run the MRS command programmed in loca-
tions 5 - 8 of UPMB.
5)
MBMR’s TLFB field should be changed to 8, to constitute 8-beat refresh Bursts.
6)
MCR should be written with 0x80808130 to run the refresh sequence (8 refresh cycles are
performed now)
7)
MBMR’s TLFB field should be restored to 4, to provide 4-beat refresh Bursts for normal op-
eration. The SDRAM is initialized and ready for operation.
4•8•2
SDRAM Refresh
The SDRAM is refreshed using its auto-refresh mode. I.e., using UMPB’s periodic timer, a burst of
four auto-refresh commands is issued to the SDRAM every 62.4
µsec, so that all 2048 SDRAM rows
are refreshed within specified 32.8 msec.
TABLE 4-7. SDRAM’s Mode Register Programming
Value @ Frequency
SDRAM Option
50MHz
25MHz
Burst Length
4
4
Burst Type
Sequential
Sequential
CAS Latency
2
1
Write Burst Length
Burst
Burst
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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